JEDEC Trays vs. IC Shipping Tubes vs. Thermoformed Trays

Choosing the right semiconductor packaging is not simply a matter of finding something the component will fit inside. The package also needs to support how the part will be stored, handled, transported, inspected, and used in production.

In many applications, the choice comes down to three primary formats: IC shipping tubes, JEDEC trays, or custom thermoformed trays. Each has advantages, but they are not interchangeable. The right choice depends on the component, the process, and the level of protection required.

Comparing Common Semiconductor Packaging Formats

The table below provides a general starting point. The final decision should also consider component geometry, allowable movement, production equipment, temperature requirements, shipping conditions, and whether a suitable standard package already exists.

When the correct format is not obvious, we normally begin by looking at the component dimensions, sensitive features, handling process, and how the customer plans to use the package. That usually makes it possible to narrow the options fairly quickly.

For nonstandard applications, visit our custom ESD packaging consultation page.

When to Use IC Shipping Tubes

IC shipping tubes are commonly used when components need to remain aligned in a linear arrangement. A properly matched profile keeps the parts oriented while limiting movement during handling, storage, and transportation.

IC shipping tubes are often a good choice when:

• the component has an established package profile;
• the parts must remain in a consistent linear orientation;
• compact storage is important;
• the tube will support manual or automated loading and unloading;
• the production process uses linear component feeding;
• contact between individual components must be controlled.

Tube selection should consider the body dimensions, lead configuration, orientation, material requirements, and the amount of movement that can be allowed inside the profile.

A profile that is too loose may allow the parts to shift or rotate. A profile that is too tight may place pressure on the leads, body, or other sensitive features. The goal is controlled clearance—not simply the smallest tube the component can be pushed into.

Malaster supplies IC shipping tube solutions for DIP, SOIC, SOJ, QFN, SOP, TSOP, TSSOP, optoelectronic devices, and related semiconductor packages.

When to Use JEDEC Trays

JEDEC trays organize components in a repeatable matrix, with each device held in an individual cavity. This helps maintain orientation and spacing during handling, storage, inspection, and production.

JEDEC trays may be the preferred option when:

• repeatable component orientation is required;
• parts must be presented in an organized matrix;
• the trays will be stacked during storage or transportation;
• automated handling or pick-and-place equipment is involved;
• each component must remain separated in its own cavity;
• a compatible standard tray already exists.

Selecting a JEDEC tray involves more than matching the overall length and width. The cavity geometry, matrix, material, stacking features, temperature rating, and compatibility with the customer’s equipment all need to be considered.

It is also important to establish whether the trays will be used only for normal handling or whether they must support baking, elevated temperatures, washing, or another production process.

When to Use Custom Thermoformed Trays

Custom thermoformed trays are often used when an existing tube or standard tray does not fit the component or does not support the required handling process.

Instead of trying to adapt the part to an existing package, the tray can be designed around the actual component or assembly.

A custom thermoformed tray may be appropriate when:

• the device has an unusual or nonstandard shape;
• the product is an assembly rather than a conventional integrated circuit;
• connectors, leads, optics, or sensitive surfaces require clearance;
• the component must remain in a specific orientation;
• inspection access is needed while the part remains in the tray;
• robotic handling or defined pick points must be incorporated;
• multiple components need to be organized as a kit;
• an existing package allows too much movement.

A custom cavity can include walls, ledges, support points, clearance areas, finger access, stacking features, and orientation details based on the part and the way it will be handled.

One of the most important parts of the design is deciding where the tray should support the component—and where it should not touch it. Fragile leads, connectors, optical surfaces, solder joints, and other sensitive features may require controlled clearance.

What About Tape-and-Reel Packaging?

Tape-and-reel packaging is widely used for high-volume automated component placement. Malaster does not supply tape-and-reel systems. Our focus is IC shipping tubes, JEDEC trays, custom thermoformed trays, ESD protective boxes, foam inserts, and related handling and shipping solutions.

When Additional Shipping Protection Is Needed

A tube or tray may organize the components properly but still require additional protection for transportation. In those situations, the primary package can be combined with an outer ESD-safe box and cushioning system.

Depending on the application, that system may include:

• conductive or static-dissipative boxes;
• custom-cut foam inserts;
• convoluted lid foam;
• cushioning pads;
• partitions or dividers;
• additional ESD protective materials.

The best solution may include several packaging components working together. For example, a group of IC tubes may be held inside a custom-cut foam insert, or a loaded tray may require an outer box and lid foam to prevent movement during shipment.

The outer package should be selected based on the weight and fragility of the contents, the shipment method, expected handling conditions, stacking exposure, and the amount of impact protection required.

How to Choose the Right Packaging Format

A useful place to begin is with two questions: does a suitable standard package already exist, and how must the component be presented or handled?

Choose an IC shipping tube when:

• a compatible standard or custom tube profile is available;
• linear handling or feeding is required;
• compact storage is a priority.

Choose a JEDEC tray when:

• the component fits a suitable tray cavity;
• matrix organization and repeatable orientation are required;
• stacking or automated handling is important.

Choose a custom thermoformed tray when:

• the component does not fit an existing standard package;
• specific features or surfaces require controlled support or clearance;
• the package must support a custom handling, inspection, or automation process.

Add an ESD box or foam system when:

• additional cushioning or impact protection is required;
• multiple tubes, trays, or components must be shipped together;
• the primary package needs to be secured inside an outer enclosure.

Information to Provide for a Packaging Review

The more information we have about the part and the application, the easier it is to determine whether an existing package will work or whether a custom solution is needed.

Helpful information includes:

• component manufacturer and part number;
• package type;
• part drawing or CAD model;
• overall dimensions and tolerances;
• lead, connector, or contact geometry;
• sensitive surfaces or restricted contact areas;
• the desired quantity per tube or tray;
• whether the package will be used for shipping, storage, inspection, or production;
• manual or automated handling requirements;
• ESD material requirements;
• temperature or baking requirements;
• estimated annual volume.

Find the Right Semiconductor Packaging Solution

There is no single packaging format that is right for every component. IC shipping tubes provide compact linear handling, JEDEC trays provide an organized and repeatable matrix, and custom thermoformed trays can be designed around parts that do not fit a standard package.

When additional transportation protection is required, these formats can also be combined with ESD boxes, foam inserts, cushioning materials, and outer packaging to create a complete system.

Not sure which format is the best fit?

Send us the component part number, drawing, CAD file, dimensional information, or a physical sample. We can review the application and help determine whether an existing IC tube, JEDEC tray, protective box system, or custom thermoformed tray is the most practical direction.

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