Malaster custom packaging

Custom ESD
Packaging Solutions

Packaging built around your device and the way you handle it.

Malaster helps turn device dimensions, protection needs and production requirements into a practical packaging solution. Start with an existing format, a modified component or a custom design.

A drawing, photograph or description of the problem is enough to start.

Custom thermoformed packaging for semiconductor devices

01 / Custom services

Start with the packaging you need.

Go directly to a service or request form. If the project involves several components, start with a packaging consultation.

Custom IC tubes

Custom IC tubes

Review a nonstandard profile, tube length and end-stop arrangement against the device outline, loading method and required retention.

Request custom tubes →

JEDEC tray solutions

JEDEC tray solutions

Explore existing and custom tray options. Device support, cavity geometry, stacking and process requirements guide the review.

Explore JEDEC tray options →

Custom thermoformed trays

Custom thermoformed trays

Define the cavity, contact areas, orientation and tray layout for your component, handling equipment and shipping requirements.

Discuss thermoformed trays →

Custom wafer separators

Custom wafer separators

Specify the wafer outline, separator material and contact requirements. Include diameter or custom shape, thickness and cleanliness needs.

Request wafer separators →

Wafer cushion foam

Wafer cushion foam

Review cushion diameter, thickness and material together with the wafer stack and usable jar depth. Include the intended compression and retention.

Request wafer cushions →

Custom ESD Velcro straps

Custom ESD Velcro straps

Specify the bundle size, strap length, width and closure arrangement. Include any color or printing needs for availability review.

Specify custom straps →

Boxes & complete packaging

Boxes & complete packaging

Coordinate the container, device support, cushioning and outer protection. Share how the loaded package moves through handling and shipment.

Discuss a packaging system →

Custom ESD bags

Custom ESD bags

Define the usable size, closure and required electrical or moisture protection. Material, thickness and quantities are reviewed for the application.

Request custom bags →

Custom ESD foam inserts

Custom ESD foam inserts

Build the insert requirement around component geometry, allowed contact areas, cavity depth and usable box space. Include loading and removal access.

Request foam inserts →

02 / Application review

The details that determine the design.

A package must support the device through loading, processing, storage and shipment. Malaster reviews the requirement across those steps so the proposed components work together.

Fit & contact

Identify the support surfaces, fragile features, lead or ball clearances, and the movement the package must control.

Handling & environment

Define orientation, pickup access, stacking, temperature exposure, cleanliness and any manual or automated handling requirements.

Protection & materials

Specify the electrical behavior, cushioning and moisture protection required. Review technical data against the actual application.

An existing format may be the right starting point.

We review whether a standard package, a modified component or a new design fits the requirement. An existing format may help avoid unnecessary tooling, subject to fit and availability. For smaller orders, see our guide to low-minimum custom ESD packaging.

03 / Development process

From a packaging problem to a defined requirement.

The first review establishes what is known, what needs to be confirmed and which packaging approach deserves a closer look.

01

Define the application

Share the device, existing packaging and the problem to solve. We review geometry, handling and protection requirements.

02

Review the approach

Compare an existing format, a modification or a custom concept. Identify material choices and details that still need confirmation.

03

Confirm the next steps

Review drawings, sample or fit-check needs, tooling, quantities and timing for the proposed solution before production planning.

04 / Project checklist

Send what you have. We can help fill in the gaps.

You do not need a finished specification to begin. These details make the initial review more useful.

Device & dimensions

Package drawing, part number, critical dimensions and areas that must remain free of contact.

Current packaging

Photos, markings, known issues and any available device or packaging samples.

Process & protection

Loading method, handling equipment, ESD requirements, cleanliness, temperature and shipping conditions.

Quantity & schedule

Initial quantity, expected repeat demand, target date and any sample or approval requirements.

05 / Common questions

Before you request a custom solution.

Does custom packaging always require new tooling?

No. An existing format or a modified component may meet the need. Tooling requirements depend on the reviewed design and manufacturing approach.

Can you work from a photograph or sample?

Yes. Photos, device drawings and existing packaging can support the initial review. Critical dimensions and physical fit may still need to be confirmed.

What affects minimum quantity and lead time?

Material, dimensions, manufacturing method, tooling and approval requirements all matter. Include the quantity and needed-by date so Malaster can review a practical supply option.

How is the ESD material selected?

Low-charging, dissipative, conductive and shielding describe different behaviors. Selection starts with the device and handling requirements, then the relevant material and packaging data. Read the ESD fundamentals guide →

What if my project uses several packaging components?

Use the general consultation request. Describe the full arrangement, including the carrier, insert, cushioning, bag and retention method, so the components can be reviewed together.

Discuss your application

Tell us what the package needs to do.

Send a drawing, photograph or description of the current problem. Include the device, handling requirements, quantity and timing. Malaster can help identify the next practical step.

Request a packaging consultation →