ESD-SAFE SEMICONDUCTOR DEVICE PACKAGING

Conductive Device Inserts

Conductive device inserts securely retain semiconductor components, integrated circuits, and precision electronic devices inside conductive ESD shipping boxes. Available in standard package outlines or custom engineered designs, Malaster insert systems provide reliable protection using either conductive foam or precision molded lid inserts for sensitive semiconductor packaging applications.

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Conductive Device Inserts for Semiconductor Packaging

Conductive device inserts for semiconductor packaging are precision thermoformed to securely retain integrated circuits, semiconductor components, and other static-sensitive electronic devices inside conductive ESD shipping boxes. By positioning each device within a dedicated cavity, these reusable inserts help reduce movement during storage, handling, and transportation while supporting reliable electrostatic discharge protection.

Malaster offers standard inserts for common semiconductor package configurations, precision foam-free retention systems, and fully custom conductive packaging solutions. With more than four decades of experience serving the semiconductor and electronics industries, we can help identify an insert and protective packaging approach suited to your component dimensions, handling requirements, and distribution environment.

Choose the Right Packaging Solution

Malaster offers several conductive packaging approaches depending on your device, handling requirements, and level of protection needed.

Conductive Box, Device Insert and Conductive Foam System

STANDARD PACKAGING SYSTEM

Box + Insert + Conductive Foam

The industry’s most common semiconductor packaging solution. A precision thermoformed conductive device insert securely positions each component while conductive foam provides gentle compression to minimize movement during storage, handling, and shipping.

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Conductive Box, Base Insert and Lid Insert System

PRECISION RETENTION SYSTEM

Box + Base Insert + Lid Insert

Engineered for applications requiring foam-free device retention. Precision conductive base and lid inserts securely capture semiconductor components while reducing particulate generation (FOD), improving repeatability, and providing dependable ESD protection for sensitive devices.

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CUSTOM ENGINEERED SOLUTIONS

Custom Semiconductor Packaging

When a standard insert isn’t available, Malaster engineers develop custom conductive packaging solutions tailored to your device, handling requirements, and manufacturing process. From concept through production, we deliver precision thermoformed packaging designed specifically for your application.

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Standard Conductive Device Inserts

Browse Malaster’s library of standard conductive device inserts for many common semiconductor package styles. Use the filters below to quickly locate an existing insert by package family or conductive box series. If your device package is not listed, our engineering team can design a custom conductive insert tailored to your application.

Image	Part Number	Product	Package Style	Box Series	PRODUCT PAGE	hf:tax:pa_package-style	hf:tax:pa_esd-box-series

Need a Custom Conductive Device Insert?

If your semiconductor package isn’t represented in our standard insert library, Malaster’s engineering team can develop a custom conductive device insert tailored to your device geometry, handling requirements, and packaging objectives. From prototype development through production tooling, we create precision ESD-safe packaging solutions designed specifically for your application.

Whether you need a custom thermoformed insert, a precision lid retention system, or a complete conductive packaging solution, we’re ready to help.

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