Custom Foam Insert Request

Tell Us About Your Foam Insert Requirements

Malaster designs precision conductive foam inserts for semiconductor devices, electronic assemblies, sensors, hybrid circuits, medical devices, aerospace electronics, and other static-sensitive products requiring secure mechanical protection.

Complete the form below with as much information as you have available. Drawings, CAD files, dimensions, photos, or existing packaging are all helpful, but not required. Our engineering team will review your application and recommend the most appropriate conductive foam solution for your project.

Whether you need a prototype, a replacement insert, or a production packaging program, we can recommend the best manufacturing process based on your quantities, tolerances, and packaging requirements.

Choosing the Best Manufacturing Method

Die-cut foam is ideal for production quantities, providing the lowest per-piece cost and highly repeatable precision.

Laser-cut foam is an excellent choice for prototypes and lower-volume production because it eliminates tooling costs and shortens lead times. Laser processing may leave a slight cosmetic carbon residue along cut edges. For applications with stringent cleanliness or FOD requirements, our engineers may recommend die-cut foam or a thermoformed device insert instead.

Helpful Files: Upload CAD files, drawings, PDFs, photos, or existing foam inserts to help our engineering team evaluate your application.