CUSTOM CONDUCTIVE FOAM INSERTS

Custom Foam Insert Request

Need a custom conductive foam insert for semiconductor devices, electronic components, or precision assemblies? Submit your component information, dimensions, drawings, CAD files, or packaging requirements and Malaster will help engineer an ESD-safe foam insert designed to provide secure retention and reliable protection during storage and shipment.

Custom Foam Insert Request

CUSTOM FOAM INSERTS

Tell us about your foam insert requirements

Share what you need to protect, your material preferences, and the quantity. Drawings or photos are helpful, but you do not need a finished design.

Fields marked with * are required.

Your details

Let us know who to contact about your request.

Insert and packaging requirements

Complete what you can. We can help with the rest.

Choosing a manufacturing method

Die-cut foam is suited to repeat production. Laser-cut foam can suit prototypes and smaller quantities without cutting-die tooling.

Laser processing may leave carbon residue along cut edges. For strict cleanliness or FOD requirements, our team may recommend die-cut foam or a thermoformed device insert.

Files and additional details

Device drawings, dimensions, or photos of your product and existing packaging can help us evaluate the fit.

Up to 5 files, 10 MB per file. PDF, JPG, PNG and ZIP accepted. Place CAD, AI, EPS, SVG, or other source files inside a ZIP archive.

What happens next? Our team will review your device, foam material, manufacturing preferences, and quantity, then contact you about suitable insert options and the next steps for a quotation.