Through-Hole and Optoelectronic Packaging

DIP / Opto Antistatic Shipping Tubes

Tube profiles for DIP, CERDIP, optoelectronic and related through-hole devices. Lead count alone does not determine fit; body dimensions, lead span, lead standoff and insertion orientation all matter.

Selecting a DIP or Optoelectronic Tube Profile

DIP-style devices may share a lead count while differing in body width, package thickness or lead geometry. Compare the component drawing to the cavity dimensions shown on the Malaster tube drawing before treating a profile as compatible.

Package bodyVerify body width and thickness, including molded features that can affect loading.
Lead geometryCheck lead span, pitch and standoff rather than relying on nominal lead count alone.
RetentionPlan pins, plugs or filler based on the tube profile, usable length and loaded quantity.

When the Listed Package Name Is Not Enough

Optoelectronic, ceramic and specialty through-hole devices often depart from common DIP dimensions. If the manufacturer drawing does not clearly match a listed profile, send the drawing or actual measured dimensions. Malaster can compare the device envelope with existing profiles and recommend the closest practical option.

Shipping note: Closing the tube is only one part of shipment protection. Bundled tubes should be restrained inside an appropriate outer package with the ESD, cushioning and labeling controls required for the application. Request application assistance →