Small-Format Interleaf Components

Bare Die & Small Substrate Separators

Tyvek separator formats for bare die, small substrates and precision components where the actual footprint, package cavity and permitted contact area determine the required cut geometry.

Select by Footprint, Contact Area and Stack-Up

Bare-die and small-substrate separators should be selected from the actual part dimensions and the way the component is supported inside its tray, cavity or package. A nominal application label does not establish fit.

FootprintCompare separator length and width with the die or substrate and the usable cavity.
Contact areaDetermine the required surface coverage and any edge clearance needed for handling or inspection.
Stack-upAccount for separator count and accumulated thickness within the available cavity or package height.

Custom Small-Format Separator Geometry

For nonstandard die or substrate dimensions, Malaster can review rectangular footprints, access features, finger slots or corner relief. State any material, cleanliness or process-documentation requirement so applicability can be confirmed for the proposed configuration.