Compare the Complete Device Envelope
SOIC and SOJ selections should be based on the full package geometry, not nominal package width alone. Compare body dimensions, lead span, lead form and standoff to the tube drawing.
Body dimensionsConfirm molded width, thickness and length where the profile constrains the device.
Lead span + formEvaluate gull-wing versus J-lead geometry and the resulting outside envelope.
Loading clearanceAllow enough freedom for loading and removal without excessive movement in transit.
Match the Device, Then Plan Retention
Once the tube profile is selected, determine closure and filler requirements from the actual tube length and loaded quantity. For a new device, a manufacturer package drawing is the fastest way to evaluate an existing profile.