3-Inch Wafer Packaging

75 mm Wafer Packaging & Components

Browse complete assemblies and individual components associated with the 75 mm wafer family. Confirm the exact supplied contents, component dimensions and loaded stack before selecting a package.

3 Inch Tyvek Wafer Separator for semiconductor wafer packaging

Tyvek Wafer Separators

MC-3TD 3-inch Round Tyvek Wafer Separator

$0.075
3 Inch Soft Wafer Cushion Foam Disc manufactured from pink open-cell antistatic foam for semiconductor wafer packaging

75mm (3")

MC-3AFD 3-inch Soft Wafer Cushion Disc, 0.25 inch

$0.225
MC-3AFDF Firm Wafer Cushion Disc

Wafer Cushion Foam Discs

MC-3AFDF 3-inch Firm Wafer Cushion Disc, 0.25 inch

$0.375
MC-3AFDF-1/8 Firm Wafer Cushion Disc

Wafer Cushion Foam Discs

MC-3AFDF-1/8 3-inch Firm Wafer Cushion Disc, 0.125 inch

$0.240
MC-316SW WafPak Wafer Packaging Assembly

75mm (3")

MC-316SW 3-inch WafPak Wafer Shipping Assembly, Open-Cell

$26.850
MC-316SWF WafPak Wafer Packaging Assembly

75mm (3")

MC-316SWF 3-inch WafPak Wafer Shipping Assembly, Closed-Cell

$17.790
MC-324SWF 3-inch WafPak Wafer Shipping Assembly, Closed-Cell

75mm (3")

MC-324SWF 3-inch WafPak Wafer Shipping Assembly, Closed-Cell

$28.700
MC-324SW WafPak Wafer Packaging Assembly

75mm (3")

MC-324SW 3-inch WafPak Wafer Shipping Assembly, Open-Cell

$25.240
MC-316JLL Lined Wafer Jar

75mm (3")

MC-316JLL 3-inch Lined Wafer Jar, Open-Cell

$13.890
MC-324JLL Lined Wafer Jar

75mm (3")

MC-324JLL 3-inch Lined Wafer Jar, Open-Cell

$13.600
MC-316ASL Wafer Jar Foam Liner

75mm (3")

MC-316ASL 3-inch Wafer Jar Liner, Open-Cell

$6.470
MC-324ASL Wafer Jar Foam Liner

75mm (3")

MC-324ASL 3-inch Wafer Jar Liner, Open-Cell

$6.470

Select by Actual Fit and Supplied Configuration

The 75 mm family may include complete WafPak assemblies as well as jars, liners, foam cushions and separators supplied individually. The nominal family label does not establish that every component fits every jar or wafer stack.

Supplied contentsCheck the exact part description for the jar, liner, cushions, separators and quantities included.
Dimensional fitConfirm actual component diameter, jar depth, liner dimensions, cushion thickness and wafer-stack height.
Material selectionChoose cushion and separator materials for the wafer surfaces, contact limits, handling process and ESD requirements.

Check Application Requirements Before Qualification

Qualify the selected 75 mm configuration under its intended loading, storage, handling and shipping conditions. State any particle limits, cleaning requirements or material documentation requirements when requesting assistance.