Circular Wafer Interleaf Components

Round Tyvek Wafer Separators

Select round separators by actual cut diameter and the intended wafer/package arrangement. Confirm edge coverage, separator count, stack-up and any application-specific material or documentation requirements.

Round Separator Selection

DiameterCompare the listed cut diameter with the wafer and the usable area of the jar or carrier.
Stack-upAccount for separator count and accumulated thickness when establishing the loaded package height.
ContactConfirm permitted surface contact and any material, cleanliness or process-documentation requirements.