MC-9TD 9-inch Round Tyvek Wafer Separator

Custom Wafer Packaging Options

Malaster can supply application-specific separator outlines alongside custom foam and complete wafer packaging configurations. Start with the actual part drawing and the faces the separator may contact. Round, square and other die-cut profiles can be reviewed around the handling method and the available packaging space.

The Wafer Jar Packaging Configuration guide explains the assembly and application examples. For drawing and contact requirements, see the custom foam insert specification guide.

Complete WafPak Product Systems

WafPak Product Systems combine the enclosure with specified foam liners or supports, cushion discs and wafer separators in a complete internal wafer shipping assembly. They offer a coordinated starting point when you need the packaging components together. Many sizes have both open-cell and closed-cell cushion options; the liner and supplied quantities can also differ between systems.

For an existing qualified pack, match the exact replacement part number. For a new assembly, ask Malaster to match the wafer dimensions, permitted contact and load quantity to the enclosure and internal materials. A similar nominal diameter does not establish compatibility with a listed WafPak system.

Supplied component counts describe what comes with the assembly; they do not establish wafer capacity or prescribe a layer sequence. Review any required shielding or moisture-barrier bag, outer cushioning and shipping carton for the actual shipment.

Select the Other Packaging Components

The enclosure establishes the available space; the sidewall liner or custom insert provides perimeter support; cushion discs provide the specified cushioning; separators form the selected contact layers. Browse wafer jars and lined configurations, wafer cushion foam discs and Tyvek wafer separators to review the component families. Match exact dimensions and materials before combining parts.

Separators, Stack Height and Final Fit

A horizontal wafer pack works as a coordinated stack. In the conventional Tyvek-separated arrangement, a separator sits between each pair of wafers and between each end wafer and its foam cushion. Three wafers between two cushions therefore use four separators. Intermediate foam changes the required contact interfaces and separator count.

The separator itself contacts the wafer surface. Choose its material and outline for the permitted contact conditions. If wafer-face contact is prohibited, request a support review before selecting a stacked arrangement. The sidewall liner surrounds the stack and serves a different function from the upper and lower cushion discs.

Closed stack height = combined wafer thickness + combined separator thickness + cushion thickness under the intended compression. Include every layer and compare the result with the usable closed-lid depth. Check loading, removal and the lowest and highest intended wafer counts. Excessive compression can load a fragile wafer or prevent proper closure; an underfilled pack can allow unwanted movement.

Use the wafer packaging configuration guide to review layer order, foam selection and fit. Record the selected part numbers, quantities and packing sequence so replenishment preserves the intended configuration.

Material and ESD Considerations

Tyvek is the separator material for this item. Select the grade and surface-contact characteristics against your wafer and process requirements; a separator designation alone does not establish a complete package ESD or cleanliness qualification.

When replacing an approved interleaf, provide its grade, outline, thickness and current specification. Malaster can also review BLAC, a thin black polyethylene interleaf, for applications requiring that material. Tyvek and BLAC are not automatic substitutes: their handling, electrical and stack-height characteristics must be considered with the rest of the pack.

Configure Your Wafer Packaging

Send Malaster the part drawing or actual outline, thickness, quantity per pack, permitted contact areas, loading method and shipping conditions. Include any approved materials, ESD or cleanliness requirements and your current packaging part numbers. We can review MC-9TD as a replacement component, a standard configuration or the starting point for a custom packaging requirement.

Discuss your wafer packaging requirements or browse WafPak Product Systems.