12-Inch Wafer Packaging

300 mm Wafer Packaging & Components

Browse 300 mm wafer packaging by supplied configuration, including complete assemblies and individual jars, liners, separators or cushion components. Verify the exact dimensions and contents of each product listing before treating it as a complete shipper.

MC-300TD Tyvek Wafer Separator

300MM (12")

MC-300TD 300 mm Round Tyvek Wafer Separator

$1.500
MC-300JL Wafer Jar and Lid

300MM (12")

MC-300JL 300 mm Wafer Jar and Lid, 65 mm Deep

$31.670
MC-300WC Wafer Carrier

300MM (12")

MC-300WC 300 mm Wafer Carrier, 25 mm Deep

$60.150
Horizontal Wafer Shipper MC-298SWF – Complete Wafer Jar Assembly for 298mm Wafers

Horizontal Wafer Shippers

MC-298SW 298 mm WafPak Wafer Shipping Assembly, Open-Cell

$74.860
Horizontal Wafer Shipper MC-298SWF – Complete Wafer Jar Assembly for 298mm Wafers

Horizontal Wafer Shippers

MC-298SWF 298 mm WafPak Wafer Shipping Assembly, Closed-Cell

$74.860
Horizontal Wafer Shipper MC-300WCS – Complete Wafer Jar Assembly for 300mm Wafers

Horizontal Wafer Shippers

MC-300WCS 300 mm WafPak Wafer Shipping Assembly, Open-Cell

$68.240
MC-300ASL 63mm closed-cell pink Ethafoam wafer jar foam liner for MC-300JL horizontal wafer shipper

300MM (12")

MC-300ASL 300 mm Wafer Jar Liner, Closed-Cell

$1.790
MC-298AFD Soft Wafer Cushion Disc

300MM (12")

MC-298AFD 298 mm Soft Wafer Cushion Disc, 0.25 inch

$4.075
MC-298AFDF-1/4 Firm Wafer Cushion Disc

Wafer Cushion Foam Discs

MC-298AFDF-1/4 298 mm Firm Wafer Cushion Disc, 6 mm

$4.950
298 MM Firm Wafer Cushion Foam Disc manufactured from pink closed-cell antistatic foam for semiconductor wafer packaging

Wafer Cushion Foam Discs

MC-298AFDF 298 mm Firm Wafer Cushion Disc, 0.125 inch

$4.200
300 MM Firm Wafer Cushion Foam Disc manufactured from pink closed-cell antistatic foam for semiconductor wafer packaging

Wafer Cushion Foam Discs

MC-300AFDF 300 mm Firm Wafer Cushion Disc, 6 mm

$4.200

Complete Assembly or Individual Component?

Products in this category are not all supplied in the same configuration. Review the individual product description for exactly what is included rather than assuming every 300 mm listing contains the jar, liner, cushions and separators. Also use the actual dimensions shown for the selected product rather than relying only on the nominal category size.

Assembly contentsConfirm the jar or housing, liner, cushion discs, separator material and quantities included under the exact part number.
Actual dimensionsCheck the stated component diameter or footprint and do not assume every item in the category is dimensionally identical.
Loaded stack heightCalculate wafer count plus separators and cushions against the usable depth of the selected package.

Qualification Notes for 300 mm Wafer Packaging

Match separators, cushions and liners to permitted contact surfaces, ESD requirements and particle limits. If a cleanliness level, material test, certification or other controlled requirement applies, identify it with the exact configuration so documentation and applicability can be reviewed.