MC-300WCS 300mm Horizontal Wafer Shipper Assembly

The MC-300WCS is a complete horizontal wafer shipper assembly for 300mm (12-inch) wafers. It includes one MC-300WS wafer jar and lid, three MC-300AFDS-1/4 soft foam cushions, and six MC-300TD Tyvek® separators.

The Horizontal Wafer Shipper MC-300WCS is a complete packaging assembly for 300mm (12-inch) semiconductor wafers. It combines a wafer jar and lid, soft antistatic foam cushioning, and Tyvek® separators to help limit movement, reduce direct surface contact, and protect wafers during storage, handling, and transportation.

What Is Included

Each MC-300WCS assembly includes:

  • MC-300WS wafer jar and lid (Qty: 1)
    Provides the primary enclosure for horizontal storage, handling, and transportation of 300mm wafers.
  • MC-300AFDS-1/4 soft foam disc cushions (Qty: 3)
    Three 1/4-inch soft antistatic foam discs provide compliant cushioning to help absorb vibration and limit movement inside the closed assembly.
  • MC-300TD Tyvek® wafer separators (Qty: 6)
    Low-particle interleaf separators help reduce direct surface contact and abrasion during wafer handling, storage, and shipment.

How the Assembly Protects 300mm Wafers

The wafer jar and lid form the protective outer enclosure, while the soft foam discs provide cushioning inside the assembly. The Tyvek® separators create lightweight protective layers between wafer surfaces and adjacent components. Together, the components provide a matched packaging system without requiring the jar, cushioning, and separators to be sourced separately.

Typical Applications

  • Storage and movement of 300mm wafers within semiconductor manufacturing operations
  • Transportation between fabrication, inspection, research, and processing facilities
  • Controlled-environment handling where low-particle separation and surface protection are important
  • Wafer packaging applications requiring replaceable cushioning and separator components

Replacement and Custom Components

Replacement wafer cushion foam discs and Tyvek® wafer separators are available separately. Malaster can also assist with alternative materials, thicknesses, quantities, and custom wafer packaging configurations when the standard MC-300WCS assembly does not match the application.

Explore our semiconductor wafer jar packaging options to compare complete assemblies and related protective components.

Weight 2.5 lbs
Dimensions 15.5 × 15.5 × 2.125 in
Material

Multi-Material Assembly

Product Size

300MM (12")

Wafer Product Type

Complete Assembly

Wafer Size

300MM (12")

Current unit price Estimated unit price after adding the quantity selected below.

$68.240

Quantity Price
0 - 5 $68.240
6 - 20 $61.416
21 - 35 $54.592
36 - 50 $47.768
51 + $40.944
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SKU: MC-300WCS Categories: , Tag:

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