Choose the Separator by the Contact Area
A separator is an interleaf component within a larger packaging system. Its cut size should match the substrate and intended contact area while leaving the edge clearance, access and stack height required by the application.
Round SeparatorsCircular interleaf components selected by actual cut diameter and the wafer/package arrangement.Square SeparatorsSquare and rectangular interleaf components for wafers, substrates and precision surfaces.Bare Die SeparatorsSmaller interleaf formats where actual die/substrate dimensions and packaging cavity drive selection.
Do not select from nominal wafer size alone. Confirm actual cut dimensions, separator count, accumulated stack thickness and permitted contact surfaces.
Custom Converting for Nonstandard Geometry
Custom diameter or footprintSpecify the actual wafer, die or substrate dimensions and the desired edge coverage.
Finger slots and reliefsAccess features or corner relief can be reviewed where handling or package geometry requires them.
Documentation requirementsState any material, cleanliness or process-documentation requirement so availability can be confirmed for the selected separator.