MC-4AFD 4.25-inch Soft Wafer Cushion Disc, 0.25 inch
MC-4AFD 4.25-inch soft wafer cushion disc, nominal thickness 0.25 inch. Soft antistatic open-cell polyurethane foam. Select with the actual enclosure, liner and wafer separators; custom sizes and profiles can be reviewed.
MC-4AFD Product Details
4.25-inch Soft Wafer Cushion Disc, 0.25 inch
The MC-4AFD soft wafer cushion disc provides controlled cushioning within a horizontal wafer packaging assembly. This round disc is made from soft, antistatic open-cell polyurethane foam and has a nominal 4.25-inch diameter and 0.25-inch thickness. Select the disc together with the actual enclosure, liner, separators and intended wafer stack.
Supplied as an individual foam cushion disc. The jar, sidewall liner and wafer separators are separate components. Match exact dimensions and materials before combining parts; do not substitute a 4-inch component where a 4.25-inch disc is required.
Disc diameter
4.25 inch
Nominal thickness
0.25 inch
Foam type
Open cell
Response
Soft
MC-4AFD Specifications
| Malaster part number | MC-4AFD |
|---|---|
| Product type | Round wafer cushion foam disc |
| Listed disc diameter | 4.25 inch |
| Nominal thickness | 0.25 inch |
| Material | Soft, antistatic open-cell polyurethane foam |
| Color | Pink |
| Supplied as | Individual cushion disc |
Listed dimensions identify the selected component. Confirm actual part tolerances, usable enclosure clearance and closed-pack fit when defining or changing an assembly.
Assembly and Final Fit
A horizontal wafer pack is a coordinated stack. Cushion discs provide the specified cushioning; separators form the selected contact layers; a sidewall liner or custom insert provides perimeter support. Include every layer when comparing combined stack height to usable closed-lid depth.
Excessive compression can load a fragile wafer or prevent proper closure; an underfilled pack can allow movement. The separator itself contacts the wafer surface, so select its material and outline for the permitted contact conditions. If wafer-face contact is prohibited, request a support review before selecting a stacked arrangement.
Review the wafer jar packaging configuration guide for layer order, foam selection and final-fit considerations.
Material and ESD Considerations
AFD is a soft, flexible open-cell antistatic polyurethane foam. Its compliant construction is considered together with cushion thickness, compression and permitted contact.
| Typical surface resistivity | 1 x 108 to 1 x 1012 ohms per square; ASTM D257 |
|---|---|
| Typical static decay | 5000 V to 50 V in less than 5 seconds; FTMS 101C, Method 4046 |
These are typical AFD material properties from Malaster MDS-AFD-001, Revision A. They are not a lot-specific test certificate or a finished-package performance rating. Request current material documentation when establishing acceptance requirements.
Custom Wafer Packaging
Malaster can review custom cushion diameters, thicknesses, cutouts and foam profiles when a standard disc does not provide the required support. Send the part drawing or actual outline, thickness, quantity per pack, permitted contact areas, loading method and shipping conditions.
Discuss your wafer packaging requirements or see the custom foam insert specification guide.
| Weight | .002 lbs |
|---|---|
| Dimensions | 4.25 × 4.25 × .25 in |
| Product Size | 100MM (4") |
| Material | A/S Open-Cell Foam |
| Wafer Product Type | Foam Cushion |
| Form Factor | Round |
$0.400
| Quantity | Price |
|---|---|
| 0 - 249 | $0.400 |
| 250 - 499 | $0.360 |
| 500 - 999 | $0.320 |
| 1000 - 2499 | $0.280 |
| 2500 + | $0.240 |
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