6-inch Wafer Jar and Lid, 1.5-inch Deep | MC-605602JL

The MC-605602JL 6-inch wafer jar and lid provides the polypropylene enclosure for a horizontal wafer packaging configuration. Listed jar depth: 1.5 inches.

Supplied as one jar body and matching lid. Foam liners, cushion discs and wafer separators are purchased separately. The jar body and lid have no assigned ESD rating.

Need the matched assembly? Explore WafPak Product Systems with foam and separators, or ask Malaster about custom wafer packaging configurations.

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These components are commonly used with this product to complete your packaging solution.

MC-605602JL Product Details

6-inch Wafer Jar and Lid

The MC-605602JL 6-inch wafer jar and lid provides physical containment for horizontal wafer packaging during storage, handling and transport. Its injection-molded polypropylene body and matching lid form the enclosure for a packaging configuration selected around the wafer and its handling requirements.

This item includes one jar body and matching lid, with a listed jar depth of 1.5 inches. Foam liners, cushion discs and separators are purchased separately. For a matched assembly, explore the WafPak Product Systems below. Malaster can also configure custom internals around your wafer or component.

Wafer Family

6-inch

Listed Depth

1.5 Inches

Material

Polypropylene

Supplied As

Jar and Lid

MC-605602JL Specifications

Malaster Part Number MC-605602JL
Product Type Horizontal wafer jar and lid
Nominal Wafer Family 150 mm / 6-inch
Listed Jar Depth 1.5 inches
Body and Lid Material Injection-molded polypropylene (PP) homopolymer
Included Components One jar body and matching lid
Unit of Sale Each jar-and-lid set
Jar and Lid ESD Rating No assigned ESD rating

The wafer-family designation is nominal. Confirm the actual wafer outline, jar cavity and usable closed-lid depth for the selected configuration before defining the stack.

Custom Wafer Packaging Configurations

Malaster can adapt standard wafer jars with custom foam profiles, liners, cushions and separators. For MC-605602JL, the starting point is the actual part envelope and usable jar cavity, followed by the support, surface-contact and handling requirements.

Wafer size and shape Custom foam openings and profiles can locate smaller round wafers or suitable square and irregular outlines within the available jar space.
Sensitive surfaces and features Define permitted support areas and keep specified faces, coatings, edges or projections clear of the foam.
Loading and removal Side-centered finger-access slots can provide room for placement and extraction where the handling method permits contact.
Fragile wafer corners Corner relief creates clearance around sharp tips so they can pass the foam without catching during loading or removal.
Variable wafer quantities Select cushion and spacer arrangements for the intended minimum and maximum load, including changes in stack height.

Malaster has configured 6-inch jars for square solar wafers and other jar formats for mounted wafer frames, dicing blades and processing tools. These applications use different support arrangements. A frame must be reviewed as a complete mounted assembly; a blade holder may locate through the center hole while keeping the cutting edge clear. The selected jar must accommodate the full part and insert geometry.

For square wafers, check the corners. A square’s diagonal is longer than its side. The complete outline must fit with the foam and loading clearance, so the 6-inch jar designation does not establish a maximum square-wafer side length.


Malaster square wafer jar inserts comparing side-centered finger access slots with corner relief cutouts around a thin wafer.
Illustrative Malaster custom foam features: side slots provide handling access; corner relief provides clearance around fragile corners. These examples show customization capabilities, not the supplied MC-605602JL jar or a size comparison.

See the Wafer Jar Packaging Configuration guide for the exploded assembly, layer arrangements and Malaster’s square-wafer, mounted-frame and blade-holder examples.

Choose a Complete WafPak Product System

WafPak Product Systems combine the jar and lid with the specified foam liner, cushion discs and wafer separators in a matched wafer packaging assembly. Both 6-inch systems below use MC-605602JL and provide a more complete starting point for wafer storage, handling and shipping.

MC-602SW WafPak System

Soft, antistatic open-cell polyurethane foam configuration.

MC-602SWF WafPak System

Firm, antistatic closed-cell polyethylene foam configuration.

These are the supplied component quantities, not a wafer-capacity rating or a prescribed layer sequence. Select the arrangement for the wafer thickness, contact requirements and intended load. Review any required shielding bag, outer cushioning and shipping carton with the configured jar.

Lined Jars and Individual Components

Choose MC-605602JLL for this jar and lid with the open-cell liner, or MC-605602JLF for the closed-cell liner. Each lined-jar option contains one jar-and-lid set and one liner; cushion discs and wafer separators are purchased separately.

For an existing configuration or individual replenishment, select the open-cell liner, closed-cell liner, soft foam discs, firm foam discs and MC-6TD round Tyvek wafer separators as required. Keep the selected part numbers and quantities with the packing instructions.

Wafer Separators and Surface Contact

Wafer separators, also called interleaves, separate adjacent surfaces. In the conventional Tyvek-separated arrangement shown in the configuration guide, a separator goes between each pair of wafers and between each end wafer and its foam cushion. Three wafers between two cushions therefore use four separators; intermediate foam or another specified arrangement changes that count.

The separator itself contacts the wafer. Select its material and outline for the permitted surfaces, and include every separator’s thickness in the stack calculation. If face contact is prohibited, request a support review before choosing a stacked arrangement.

Browse Tyvek wafer separators for standard options, or request custom shapes and BLAC black polyethylene interleaves. Malaster can review separator material, electrical requirements and handling together; Tyvek and BLAC should not be substituted solely because their outlines match.

Foam Selection, Stack Height and Final Fit

AFD open-cell polyurethane provides softer cushioning; AFDF closed-cell polyethylene provides firmer support. Choose construction, thickness and compression together. A same-size disc in a different foam can change how the package supports and loads the wafer.

Closed stack height = combined wafer thickness + combined separator thickness + cushion thickness under the intended compression.

Compare that total with usable closed-lid depth. The sidewall liner surrounds the stack and affects radial clearance; check its height separately. Evaluate both the lowest and highest intended wafer counts, and confirm that the package closes with the intended restraint. Excessive compression can load fragile wafers.

The wafer packaging configuration guide explains the layer sequence and fit checks in more detail. Compare foam cushion materials and sizes when specifying the internals.

Material and ESD Considerations

The polypropylene jar body and lid have no assigned ESD rating. The selected foam, separators and any surrounding packaging provide their specified electrical functions. An antistatic foam rating does not establish a rating for the jar or the complete package.

Define required electrical performance, cleanliness and allowed surface contact for the supplied configuration. Malaster can provide the applicable material information, including the Horizontal Wafer Jar Material data sheet (MDS-WJ-001), foam data sheets and Wafer Packaging Solutions Guide (MDS-WPG-001).

Configure the Package Around Your Wafer

Send a drawing, dimensions or photographs, the wafer thickness, quantity per jar and any surfaces that must avoid contact. Include MC-605602JL or the WafPak system you are considering, plus any loading, cleanliness or electrical requirements.

You do not need a finished packaging design to start. Malaster can review the jar, custom foam, separators and packing arrangement together, then document the selected configuration for repeat orders.

Request a Wafer Packaging Review →

Weight .265 lbs
Dimensions 7 × 7 × 1.75 in
Form Factor

Round

Material

Polypropylene

Wafer Product Type

Wafer Jar

Wafer Size

150MM (6")

Current unit price Estimated unit price after adding the quantity selected below.

$7.480

Quantity Price
0 - 5 $7.480
6 - 20 $6.732
21 - 35 $5.984
36 - 50 $5.236
51 + $4.488
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SKU: MC-605602JL Categories: , ,

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