MC-725AFDF-1/8 7.25-inch Firm Wafer Cushion Disc, 0.125 inch

Custom Wafer Packaging Options

Malaster can review custom cushion diameters, thicknesses, cutouts and foam profiles when a standard disc does not provide the required support. The same configuration service can coordinate liners, separators and the enclosure around the part, including suitable square wafers, mounted frames and processing tools.

Malaster has configured 6-inch jars for square solar wafers and other jar formats for mounted wafer frames, dicing blades and processing tools. A frame is reviewed as a complete mounted assembly, including tape and projections. A blade holder may support through the center hole while keeping the cutting edge clear. These examples describe broader customization capabilities; fit depends on the selected enclosure and insert geometry.

For a square part in a round enclosure, check its corner-to-corner dimension as well as its side length. The foam and loading clearance need additional space. A nominal wafer-family label alone does not establish the maximum square size.

The Wafer Jar Packaging Configuration guide explains the assembly and application examples. For drawing and contact requirements, see the custom foam insert specification guide.

Complete WafPak Product Systems

WafPak Product Systems combine the enclosure with specified foam liners or supports, cushion discs and wafer separators in a complete internal wafer shipping assembly. They offer a coordinated starting point when you need the packaging components together. Many sizes have both open-cell and closed-cell cushion options; the liner and supplied quantities can also differ between systems.

For an existing qualified pack, match the exact replacement part number. For a new assembly, ask Malaster to match the wafer dimensions, permitted contact and load quantity to the enclosure and internal materials. A similar nominal diameter does not establish compatibility with a listed WafPak system.

Supplied component counts describe what comes with the assembly; they do not establish wafer capacity or prescribe a layer sequence. Review any required shielding or moisture-barrier bag, outer cushioning and shipping carton for the actual shipment.

Select the Other Packaging Components

The enclosure establishes the available space; the sidewall liner or custom insert provides perimeter support; cushion discs provide the specified cushioning; separators form the selected contact layers. Browse wafer jars and lined configurations, wafer cushion foam discs and Tyvek wafer separators to review the component families. Match exact dimensions and materials before combining parts.

Separators, Stack Height and Final Fit

A horizontal wafer pack works as a coordinated stack. In the conventional Tyvek-separated arrangement, a separator sits between each pair of wafers and between each end wafer and its foam cushion. Three wafers between two cushions therefore use four separators. Intermediate foam changes the required contact interfaces and separator count.

The separator itself contacts the wafer surface. Choose its material and outline for the permitted contact conditions. If wafer-face contact is prohibited, request a support review before selecting a stacked arrangement. The sidewall liner surrounds the stack and serves a different function from the upper and lower cushion discs.

Closed stack height = combined wafer thickness + combined separator thickness + cushion thickness under the intended compression. Include every layer and compare the result with the usable closed-lid depth. Check loading, removal and the lowest and highest intended wafer counts. Excessive compression can load a fragile wafer or prevent proper closure; an underfilled pack can allow unwanted movement.

Use the wafer packaging configuration guide to review layer order, foam selection and fit. Record the selected part numbers, quantities and packing sequence so replenishment preserves the intended configuration.

Material and ESD Considerations

AFDF is a firm, closed-cell antistatic polyethylene foam. It provides a different mechanical response from soft open-cell AFD foam. Select the support response and cushion thickness together; changing from one material to the other can change the closed-pack fit.

Antistatic foam is one element of an ESD packaging design. Its material properties do not establish shielding performance or qualify the jar, separator and finished shipping package as a whole. Specify any required electrical test method, material documentation and environmental or cleanliness requirements with the application.

Configure Your Wafer Packaging

Send Malaster the part drawing or actual outline, thickness, quantity per pack, permitted contact areas, loading method and shipping conditions. Include any approved materials, ESD or cleanliness requirements and your current packaging part numbers. We can review MC-725AFDF-1/8 as a replacement component, a standard configuration or the starting point for a custom packaging requirement.

Discuss your wafer packaging requirements or browse WafPak Product Systems.