MC-8875AFDF 8.875 in.Firm Wafer Cushion Foam Disc

Detailed Product Description

The MC-8875AFDF Firm Wafer Cushion is an 8.875-inch diameter, 0.25-inch thick antistatic closed-cell polyethylene foam disc engineered to help protect semiconductor wafers and other delicate substrates during storage, handling, and transportation.

Its firm closed-cell construction provides stable support and controlled spacing within horizontal wafer packaging systems while helping reduce abrasion, vibration transfer, wafer movement, and handling damage. Compared with softer open-cell cushioning materials, the MC-8875AFDF offers greater dimensional stability and reduced compression.

The antistatic polyethylene foam helps minimize electrostatic charge buildup around static-sensitive semiconductor materials. Its low moisture absorption and durable construction also make it suitable for contamination-controlled and cleanroom-related packaging applications.

Specifications

• Part Number: MC-8875AFDF
• Product Type: Firm wafer cushion foam disc
• Diameter: 8.875 in (225.43 mm)
• Thickness: 0.25 in (6.35 mm)
• Material: Antistatic closed-cell polyethylene foam
• Construction: Firm closed-cell foam
• Primary Application: Semiconductor wafer storage, handling, and transport

Practical Applications

The MC-8875AFDF is designed for semiconductor packaging and wafer-handling applications that require firm support, controlled spacing, and antistatic protection.

• Provides ESD-safe support and cushioning for semiconductor wafers during storage and transport.
• Helps reduce scratching, abrasion, vibration transfer, wafer movement, and handling damage.
• Supports controlled spacing within horizontal wafer packaging systems.
• Suitable for wafer jars, wafer shippers, wafer carriers, and wafer storage assemblies.
• Supports contamination-conscious and cleanroom-related handling operations.

Key Features and Benefits

1. Firm Closed-Cell Foam Construction:
   Provides supportive cushioning with reduced compression and improved dimensional stability.
2. Antistatic Protection:
   Helps minimize electrostatic charge buildup around sensitive semiconductor wafers and substrates.
3. Precision Dimensions:
   Manufactured at 8.875 inches in diameter and 0.25 inches thick for use in compatible horizontal wafer packaging systems.
4. Controlled Wafer Support:
   Helps maintain wafer positioning and spacing during storage, handling, and shipment.
5. Low Moisture Absorption:
   The closed-cell structure helps resist moisture absorption and supports stable packaging performance.
6. Durable Construction:
   Maintains structural integrity and cushioning performance through repeated handling and transportation.

Advantages of Firm Closed-Cell Wafer Cushioning

• Improved Structural Support:
  Firm closed-cell foam provides greater support and reduced compression compared with softer open-cell materials.
• Consistent Dimensional Stability:
  Helps maintain controlled spacing and wafer positioning within the packaging system.
• Reliable ESD Control:
  Antistatic properties help reduce electrostatic charge buildup around sensitive semiconductor materials.
• Reduced Moisture Absorption:
  Closed-cell construction absorbs less moisture than many open-cell cushioning materials.
• Designed for Semiconductor Packaging:
  Intended for wafer-handling applications where cleanliness, support, and ESD protection are important.

Compatible Packaging Components

The MC-8875AFDF may be used with compatible components within Malaster horizontal wafer packaging systems, including:

• Wafer jars and wafer packaging systems
• Horizontal wafer carriers
• Wafer shippers and storage assemblies
• Wafer cushion and separator configurations
• Custom semiconductor packaging assemblies

Why Choose Malaster Wafer Cushion Foam Discs?

Malaster supplies precision packaging materials for semiconductor manufacturers, electronics companies, distributors, and other operations handling static-sensitive components. Our wafer cushion foam discs are designed to provide consistent dimensions, dependable cushioning, and ESD-safe support for valuable semiconductor wafers.

• Designed specifically for semiconductor wafer packaging applications
• Available in multiple diameters, thicknesses, and foam constructions
• Supports horizontal wafer jars, carriers, shippers, and storage systems
• Suitable for contamination-controlled and cleanroom-related applications
• Custom converting and packaging configurations available

Custom Sizes and Configurations

Malaster can manufacture wafer cushion foam discs in multiple diameters, thicknesses, materials, and converted formats to support specialized semiconductor packaging requirements. Square, rectangular, ring-shaped, and application-specific configurations may also be available depending on the packaging system and component requirements.

Learn more about available
wafer cushion foam discs
or contact Malaster to discuss a custom wafer packaging application.