Category Archives: Recently Updated

Technical resources that have been recently revised with new engineering information, product updates, standards, or application guidance.

General Articles, ESD Packaging Resources, Packaging Design, Packaging Materials, Recently Updated

How to Specify a Custom ESD Foam Insert for Electronic Components

Posted on by Melissa Hamro
Electronic components secured in a custom conductive foam insert beside pink antistatic and black conductive foam samples
25
Aug

Custom Foam Insert Specification A custom ESD foam insert should be designed around the component, the surrounding package and the work the foam must perform. Start with a drawing, CAD file, sample or accurate dimensions. Identify delicate features and surfaces that need clearance, provide the available box space and quantity, and include any defined electrical […]

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Recently Updated, Component Handling, ESD Packaging Resources, Packaging Materials

ESD Rubber Bands: The Complete Guide to Static Dissipative and Conductive Bands

Posted on by Malaster Technical Team
Black and pink ESD rubber bands displayed beside a black ESD protective box and static-control packaging.
25
Aug

Learn how ESD rubber bands help protect static-sensitive electronic components during packaging, storage, and handling. This comprehensive guide explains the differences between static dissipative and conductive rubber bands, sizing, applications, compliance documentation, and how to choose the right band for your electronics packaging needs.

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Recently Updated, Application Engineering, ESD Packaging Resources, Featured, IC Shipping Tubes, MC Recommends

Choosing the Right Antistatic IC Shipping Tube

Posted on by Mike Cordingley
MC-150SOIC/AS antistatic IC shipping tube with SOIC-8 devices and a mechanical drawing
30
Jul

Most engineers start by asking which IC shipping tube fits their device. The better question is whether a tube is the right packaging solution at all. Learn how mechanical drawings, device geometry, ESD protection, and decades of engineering experience lead to better packaging decisions.

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