Category Archives: Featured

Curated technical resources selected by Malaster to highlight important engineering guidance, new developments, and practical semiconductor packaging solutions.

Featured, ESD Packaging Resources, ESD Standards & Compliance, IC Shipping Tubes, Technical Resources

Before You Seal the Box: 5 Checks for Shipping Electronic Components

Posted on by Mike Cordingley
DC inspecting bundled DIP IC tubes for shipping electronic components, enclosed in a shielding bag with pink antistatic bubble cushioning inside a corrugated carton.
08
Sep

From DC’s packing bench at Malaster A neatly packed box is satisfying. Before the tape goes on, though, I want to know what is happening inside it: how the components are supported, what touches them, and whether that protection will hold up through shipping and unpacking. Shipping electronic components takes more than a snug carton. […]

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General Articles, Featured, JEDEC Trays

How I Identify JEDEC Trays and Help Customers Find the Right Fit

Posted on by Melissa Hamro
Experienced tray specialist examining a full-size black JEDEC tray at a clean workspace with matching JEDEC trays nearby.
05
Aug

Malaster shares the practical process she uses to identify an existing JEDEC tray, verify revisions and temperature requirements, and gather the details needed to find the right replacement or new tray.

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Recently Updated, Application Engineering, ESD Packaging Resources, Featured, IC Shipping Tubes, MC Recommends

Choosing the Right Antistatic IC Shipping Tube

Posted on by Mike Cordingley
MC-150SOIC/AS antistatic IC shipping tube with SOIC-8 devices and a mechanical drawing
30
Jul

Most engineers start by asking which IC shipping tube fits their device. The better question is whether a tube is the right packaging solution at all. Learn how mechanical drawings, device geometry, ESD protection, and decades of engineering experience lead to better packaging decisions.

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