Curated technical resources selected by Malaster to highlight important engineering guidance, new developments, and practical semiconductor packaging solutions.
Five checks from the packing bench: movement, ESD protection, retention, bag closure and labeling, and the complete shipping package.
Review ESD box materials, foam and formed inserts, contact areas, cleanliness, printing, and discharge-shielding requirements.
Melissa explains how she uses tray markings, drawings, pocket details, and samples to identify JEDEC trays and check component fit.
Mike Cordingley explains how package geometry, lead clearance, orientation, closures, and handling determine the right IC tube.