MC-803AFDF Firm Antistatic Foam Cushion for 803-Series Boxes

Antistatic ESD Foam MC-803AFDF for 803-Series Boxes

Antistatic ESD foam MC-803AFDF provides firm, lightweight cushioning within an 803-series electronic-component packaging configuration. The pad has a listed 2.56 × 3.50-inch footprint and a 0.25-inch thickness. Its material is firm, antistatic closed-cell low-density polyethylene foam.

This product supplies one flat foam cushion. The MC-803C conductive box, additional cushions and custom component cavities are separate selections. Choose the foam according to the device and its handling requirements as well as the box series.

MC-803AFDF Specifications

Listed dimensions identify this cushion. Request finished-part tolerances when needed and verify the usable enclosure space and closed-pack fit for the selected device.

Custom Foam Options for Your Component

Malaster can review a different cushion thickness, a revised outline or an insert with component-specific cavities when the flat pad does not meet the application. Support areas, relief around sensitive features and access for loading or removal can be evaluated together.

Send the component drawing, current box or cushion part number, permitted contact areas and quantity required. Include the initial order quantity and expected repeat use so the material, design and manufacturing method can be considered together.

Use the custom foam insert specification guide to prepare the available information, then request a custom foam insert. If the surrounding box or packaging method is also undecided, request a complete packaging consultation.

Select the Foam for Its Job

Choose this option when the application needs antistatic cushioning with the firmer response of closed-cell polyethylene. Confirm the support area, available height and contact pressure against the component’s handling requirements.

AFDF is the firm pink option. AFD provides softer open-cell cushioning, while CFF is a firm conductive alternative with a 0.22-inch nominal thickness. A matching footprint does not make these materials interchangeable: review thickness, electrical behavior and compression response.

Associated Box and Other 803-Series Foam Choices

Review the MC-803C conductive box for the surrounding enclosure. The following products provide other foam choices in the same series. Select each layer for its intended function and confirm the complete arrangement before substituting materials.

A shared box-series label identifies related products; it does not establish the same foam response, electrical properties or compressed height. For another enclosure size, browse ESD box foam cushions.

Component Contact, Compression and Final Fit

Identify which device surfaces may touch the foam and which leads, terminals, connectors or other features require clearance. If the arrangement requires lead penetration or a conductive contact layer, identify that requirement separately; this pink antistatic cushion is not the conductive foam option.

Consider the full closed-box arrangement: the lower support, the component, any device insert, and any upper cushion. Uncompressed foam thickness alone does not establish the space available for the component or the force applied when the lid closes.

Check that the chosen configuration restrains the part as intended, closes without forcing the lid, and permits controlled loading and removal. A flat pad does not create an individual retaining cavity. If defined component locations or protected features require a shaped support, request an insert review.

The ESD boxes and device protection guide explains the role of the enclosure and its internal packaging.

Material Properties and ESD Considerations

The following material data is recorded in Malaster MDS-AFDF-001, Revision A.

These are typical AFDF material properties, with the methods identified in the released material sheet. They are not lot certifications, and material performance can vary by grade and thickness.

The foam’s material properties do not establish discharge shielding, grounding or the performance of the complete shipping package. Review the enclosure, closure, handling process and any additional protective barrier against the application requirements.

For help comparing the electrical and mechanical choices, read antistatic versus conductive foam. Malaster can provide available material documentation and review specified electrical tests, cleanliness requirements and component-contact conditions for the proposed configuration.

Get Help Configuring Your 803-Series Package

Provide the device drawing or dimensions, quantity per box, permitted support areas, current packaging part numbers, expected handling or shipping conditions, and any specified material or documentation requirements. Include the required quantity and timing.

Malaster can review antistatic ESD foam MC-803AFDF as a replacement cushion, an alternative foam choice or part of a custom package. Send a custom foam request or discuss the complete packaging requirement.