MC-76161 Conductive Tray Insert for 48 Lead TSOP

MC-76161 Conductive Tray Insert

MC-76161 Conductive Tray Insert is a black thermoformed high-impact polystyrene (HIPS) insert for the listed 48-lead TSOP format and Malaster’s 803-series conductive box system. Request the current drawing to confirm the cavity layout and finished dimensions.

Select the insert around the complete device outline and height, including its terminals or carrier where applicable, then review the box and lid-retention arrangement. The insert, box and foam are specified separately.

Device dimensions, layout and fit

Compare body length and width, overall span across the lead rows, lead pitch and length, and device height with the current insert drawing. A lead count or nominal package size alone does not establish fit; confirm the support surfaces and clearance during loading and removal.

Component retention and packaging performance

Evaluate the complete package for the intended handling, storage and transport conditions. Conductive material reference values alone do not establish finished-package shielding or application qualification. Before reuse, inspect the insert, box and cushioning for damage, contamination and changes in fit.

Conductive HIPS material reference properties

Source: Malaster MDS-HIPS-001, Rev A, released September 10, 2026. The material is black conductive HIPS film with a gloss/matte surface and a nominal starting thickness of 0.030 inch (0.762 mm).

RH means relative humidity. Static decay is measured from ±5 kV to ±50 V. Surface resistance and surface resistivity are separate properties and are reported separately above.

Material compliance and documentation

MDS-HIPS-001 reports compliance with RoHS Directive 2011/65/EU, including amendment (EU) 2015/863, and REACH Regulation (EC) No 1907/2006, based on material declarations dated February 17, 2023. It also states that lead, mercury, cadmium and hexavalent chromium are not intentionally added and their combined concentration does not exceed 100 ppm by weight.

Request the current HIPS material sheet and supporting documentation for your application or purchase specification.

Associated 803-series boxes and package configuration

Box	Catalog dimensions, inches	Selection note
MC-803C	0.50 × 2.56 × 3.50	803-system box
MC-846C	0.75 × 2.56 × 3.50	Alternative listed height
MC-848C	1.00 × 2.56 × 3.50	Alternative listed height

Start with MC-803C. Compare the taller boxes when the device and retention arrangement require a different listed height. Confirm insert seating and usable lid clearance against drawings or a sample; catalog box dimensions do not define the available internal space.

Explore conductive ESD boxes or read the ESD box selection guide.

803-series foam and retention options

These foam choices have a listed 803 footprint of 2.56 × 3.50 inches. Select the electrical function, support and compression required by the complete insert-and-box arrangement.

CFS and CFF are 0.22 inch nominal. Skived thickness varies; request an agreed range when clearance or compression is critical. AFD is soft pink antistatic foam; AFDF is firm pink antistatic foam.

Conductive and antistatic foams serve different functions. Review permitted contact with the component before choosing a foam or substituting one type for another. Compare antistatic and conductive foam or request a custom cushion or foam insert.

Compare standard small-outline inserts

Compare the listed device formats and box families below when reviewing other standard inserts. These are selection references; their device requirements differ. A matching device-size or lead-count label does not establish interchangeability, even within the same box series.

Similar listings may differ in lead pitch or length, device-body thickness, terminal clearance or support geometry. Confirm the specific part drawing before substituting an insert. A change in box series also requires review of cavity layout, seating and lid retention.

Browse Standard Device Inserts

Custom device-insert design and production tooling

When a standard insert does not suit the device or handling process, Malaster can develop a custom thermoformed insert and the tooling needed to produce it. Bring the component requirements into the design from the start.

Custom work can start with a component drawing, CAD model, sample part or an existing packaging problem. Explore Malaster’s thermoformed ESD tray capabilities for larger trays, different layouts and production-handling applications.

Discuss Custom Design and Tooling

Optional printing and product identification

Malaster also offers custom printing on conductive device inserts. Where identification helps your process, ask about a logo, part identification or handling information.

Provide the marking content, proposed location and quantity. Review the print area alongside device-contact surfaces, clearances and handling requirements. For larger graphics or limited space on the insert, printing the associated box may be the more practical choice.

Request Printing Review

Get help selecting MC-76161 or developing a custom insert

Send the device drawing or dimensions, devices per box, planned quantities and intended handling conditions. Include lead-clearance concerns, permitted contact areas and any documentation requirements. If you are replacing an existing package, a photo and a description of the problem are useful starting points.

Malaster can help compare a standard insert, a different box system and a custom thermoformed design so the selection reflects the component and the way it will be handled.

Review Your Device Packaging

Useful packaging and material resources

• ESD boxes for electronic components: fit, retention and selection
• Antistatic vs. conductive foam: understand the material functions
• How to specify a custom ESD foam insert
• Thermoformed ESD trays: custom design and manufacturing requirements